SAMSUNG ELECTRO-MECHANICS

FCBGA is used in a variety of fields from PC and game device to Data Center and automobiles, etc.

- Client: CPU and GPU for Desktop and Note PC, SoC for Game Console

- HPC: CPU for Server, ASIC for AI accelerator

- Network: ASIC for Router/Switch

- Automotive: SoC for ADAS, Radar and Infotainment

When you go to the Contact us on the main page or the Product page, you can ask questions about technologies and purchases by each region.  

Samsung Electro-Mechanics mainly provides OSP and ENEPIG methods for FCBGA surface processing but can also develop and respond to new surface processing methods if necessary.

For BGA products, we mainly provide methods such as ENEPIG, Ni/Au, and Direct Au, and electrolytic Ni/Au can be categorized into thick Ni/Au and thin Ni/Au.

As a market leader, we provide a variety of technology Solutions with regard to FCCSP for Mobile AP to major customers in the mobile market. Starting with 0.22T thick CSP substrates in the early 2000s, for FBGA for Memory MDRAM, Flash, and eMCP/eMMC, ultra-thin CSPs of 0.1T or lower and 3-or-more-layer Build-up products are provided.

For FCBGA for Client CPU and GPU, microcircuit technology of 8/8㎛ or less as well as Coreless method are provided so as to accommodate higher performance and more I/O. FCBGA for AI accelerator and server CPUs can be provided in large body sizes up to 110x110mm.

The indication of an effective date differs by each certification institution. One certification institution, BSI, focuses on whether the certification has been renewed and evaluated regardless of the effective date on the certification. That is, even if an effective date is listed on the certification, it does not imply that all certifications are effective until that date, but instead must be continuously evaluated to maintain its certification. On the other hand, in the case where the certification effective date is a requirement, such as TS/TL, the certification effective date is indicated as such. Should an effective date confirmation certification be necessary, BSI sends officially issued documents. 

RoHS is a guideline regarding the regulated usage of six types of toxic substances (Pb, Cd, Cr6+, Hg, PBB, PBDE), and Pb Free is a regulation only for Pb.
In other words, RoHS can be said to include Pb Free. The Pb Free regulation has been in effective since a few years ago, and RoHS has been in effect in the EU since July 1, 2006. If you satisfy RoHS, then you will certainly satisfy Pb Free. 

BGA is an acronym for Ball Grid Array and is used mainly in packaged circuit boards. This is used to electrically connect the semiconductor with the mainboard, and unlike the previous lead frame (external connection line), it is embedded using a solder ball, allowing for the connection of multiple I/O.  

This is to protect the semiconductor from the external environment, including external shocks or moisture, and simultaneously allow for the input and output of electrical signals, connecting to external sockets.