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Package Substrate

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韓国最大の半導体基板メーカー

パッケージ基板(Package Substrate)はモバイルとPCの中核半導体に使用されており、半導体とメインボード間の電気的信号を
伝達する役割に加え、高価な半導体を外部ストレスから守る役割を担います。一般の基板よりもはるかに微細な回路が
形成されている高密度回路基板で、高価な半導体を直接メイン基板に装着する際に発生する組立不良やコストを削減できます。

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FAQ

  • The BGA production base is the domestic Sejong Plant, and the FCBGA products are produced at the domestic Busan Plant and the overseas Vietnamese production base.

  • FCBGA is used in a variety of fields from PC and game device to Data Center and automobiles, etc.

    - Client: CPU and GPU for Desktop and Note PC, SoC for Game Console

    - HPC: CPU for Server, ASIC for AI accelerator

    - Network: ASIC for Router/Switch

    - Automotive: SoC for ADAS, Radar and Infotainment

  • When you go to the Contact us on the main page or the Product page, you can ask questions about technologies and purchases by each region.  

  • Samsung Electro-Mechanics mainly provides OSP and ENEPIG methods for FCBGA surface processing but can also develop and respond to new surface processing methods if necessary.

  • For BGA products, we mainly provide methods such as ENEPIG, Ni/Au, and Direct Au, and electrolytic Ni/Au can be categorized into thick Ni/Au and thin Ni/Au.

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