Mobile Phone
- 7. Main Board
- 1. Cellular Front End
- RF Front-end(5G, FR1)
- mmWave Module (5G, FR2)
- Transceiver
- 2. NetWork
- WiFi Module (Communication Module)
- GPS
- 6. Chipset
- Baseband Processor
- Application Processor
- 4. Camera
- 5. Display Pane
- Display Module
- Sensor
- Memory
- 3. Power Control
- PMIC
- Charger
Product Information
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1Cellular Front End
-
2Power Control
-
3Multimedia
-
4Chipset / Memory
-
5Main Board
Tablet
- 3. Main Board
- 1. Chipset/Memory
- DRAM
- CPU/AP
- 4. Network
- 2. Camera
- 5. Display Module
- Sensor
- Audio Codec
- Storage (SSD,HDD)
- PMIC
- Charger
Product Information
-
1Chipset / Memory
-
2Multimedia
-
3Main Board
Wearable
- Smart Watch / Fitness
- Glasses
- 1. OIS Camera Module : Ultraslim, High Pixel Density, and High AF
- 2. Flexible Substrate : Convenience in Design, Enhancement of Stiffness, High Speed, High Density, and Conservation of Space
Product Information
-
1OIS Camera Module
-
2Chipset / Memory