MLCC for Thin Devices and Modules
To accommodate thin devices or modules, this can be mounted between the solder balls to reduce module thickness
or secure the mounting area. It can supply current quickly in a stable manner to high-speed APs of mobile devices
and is less susceptible to external environmental stress thanks to high-frequency noise removal.
- Thin in terms of Thickness
- Thin enough to Support Thin Devices and Modules
- Removing High Frequency Noise
- High-Frequency Noise Removal
Application
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Mobile Phone
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Wearable
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IC Package
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Module Products
Lineup
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- Normal
- Products that cover a wide range
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- LSC
- Products that support thin devices and modules
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- High Bending Strength
- Products that are resistant
to mechanical stress
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- ESD Protection
- Products to protect circuits
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- Fail Safe
- The safest product
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- Low Acoustic Noise
- Products that reduce noise
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- Low ESL
- Products with low equivalent
series inductance
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- Array
- Products that unify multiple chips
into one
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- MFC
- Products that are resistant to cracks