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Package Substrate

SiP

(System in Package)

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Package Substrate for System Implementation

It is a product that realizes complex functions as one system by mounting multiple ICs and passive components in a package.
It is also used in products such as PA (Power Amplifier) and has heat dissipation characteristics.
Product series include Flip-Chip SiP and Coreless.

Miniaturization

Multiple ICs and passive components are integrated into a single module to enable package miniaturization.

Thin Substrate

Can realize 0.2mm thin substrate (based on a 6-layer substrate) by securing the driving capability of ultrathin sheets.

Main Core Technology

Coreless RF-SiP

The coreless method reduces the insulation thickness to improve signal characteristics
by controlling Electro Magnetic Interference (EMI) and Parasitic Inductance, enabling the realization of thin substrates.

ENEPIG Surface Treatment

The ENEPIG surface treatment technology has the following characteristics.

SiP Lineup

Lineup by Specification
Mass Production Sample Available
Lineup by Specification - Layer Structure, Line Width / Space, Bump Pitch, Surface Finish
Layer Structure Cored 2L / 4L / 6L / 8L / 10L (Mass Production) + 12L / 14L (Sample Available)
Coreless 5L / 6L / 7L / 8L (Mass Production) + 4L / 9L / 10L (Sample Available)
Line Width / Space 12 / 16um (Mass Production) 10 / 15um (Sample Available)
Bump Pitch 130um (Mass Production) 105um (Sample Available)
Surface Finish Direct Au, Thin ENEPIG, Selective ENEPIG (Mass Production) Direct Au, Thin ENEPIG, Selective ENEPIG (Sample Available)

* um stands for ㎛

Application

Solutions

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