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Package Substrate

FCCSP

(Flip Chip Chip Scale Package)

Flip Chip Bonding High-Density Package Substrate
for AP/BB, Controllers

It is called a Flip Chip Chip Scale Package (FCCSP) because it is connected to the substrate in an inverted position
via bumpsratherthan via wire bonding to the semiconductor. It is mainly used for high-performance semiconductors such as
APs (ApplicationProcessors) in mobile IT devices. In addition, compared with WBCSP using gold wires, the process using
Flip Chip can be applied to igh-density semiconductors because the path of electrical signals is shorter, and
a large number of inputs/outputs can be formed.

FCCSP(Flip Chip Chip Scale Package)

Main Core Technology

Bumping Structure

Micro Ball Bump Method

  • Available for Fine Bump Pitch
  • Good for Small Bump Risk
  • Good Quality for Bump Characteristics

Substrate Type

EPS & EDS (Embedded Passive Substrate & Embedded Die Substrate)

EPS/EDS is a substrate with semiconductor passive components, ICs, etc. embedded within the substrate. Passive components are
typically used to stabilize power supply voltage levels. By embedding ICs within the substrate, package size and thickness can be reduced.

ETS (Embedded Trace Substrate)

ETS is a type of circuit substrate in which the outermost circuit pattern is embedded in insulating material. The substrate has
a coreless structure that enables microcircuits to be realized without increasing cost and facilitates layer-down design (4L → 3L).
In addition, the etching process does not affect the pattern width, allowing precise control of the circuit width.

FCCSP Lineup

Lineup by Specification
Mass Production Sample Available
Lineup by Specification - Routing Density, Low Z-Height
Routing Density Build-Up Line Width / Space 7 / 8um (Mass Production) 6 / 7um (Sample Available)
BVH / Pad Registration 40 / 67um (Mass Production) 37 / 60um (Sample Available)
SRO Diameter SR Registration 45 ± 10um (Mass Production) 40 ± 10um (Sample Available)
FC Bump Pitch (Peripheral) 40um (Mass Production) 35um (Sample Available)
FC Bump Pitch (Area) 90um (Mass Production) 80um (Sample Available)
Low Z-Height Core / PPG Thickness 40 / 18um (Mass Production) 35 / 15um (Sample Available)
SR Thickness 10 ± 4um (Mass Production) 8 ± 3um (Sample Available)

* um stands for ㎛

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