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MLCC

High Bending Strength

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MLCC with a High Tolerance to Mechanical Stress

Thermal and mechanical stress on the chip can be reduced by the ductile properties of soft termination,
which is resistant to stresses caused by board bending.

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Relax The Applied External Stress
Products that can Reduce Thermal and Mechanical Stress on the Chip
Excellent Bending Strength
Excellent Bending Strength

MLCC with Increased Durability

It is a product that applies stress-management technology against external deformation to prevent MLCC defects from taking place
when mechanical and thermal deformation of the PCB occurs. With greater durability than existing products,
it can be used in applications that require safety.

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Bending Crack Prevention
Use of Conductive Epoxy Material Technology that can Absorb Deformation Stress to Prevent Bending Cracks Caused
by PCB Deformation
5mm Bending Guarantee
Board Flex 5mm Guarantee

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