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Package Substrate

FCBGA

(Flip Chip Ball Grid Array)

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High-Density Package Substrates
for High-Integration Semiconductors

A high-density package substrate for connecting high-integration semiconductor chips to the main board.
The semiconductor chip and the package substrate are connected with Flip Chip bumps, and fine matching between layers
is required due to the miniaturization of the circuits on the substrate and the high multilayer.
In particular, large body size and high multilayer (~110x110㎜, 26L) technology is required to support high performance computing.

FCBGA(Flip Chip Ball Grid Array)

FCBGA Lineup

FCB is available in Standard Core, Thin Core type products.
Mass Production Sample Available
Lineup FCB Core Thickness(um), Line Width / Space Bump Pitch (Mass Volume) - (4L, 6L, 8L, 10L, 12L, 14L, 16L, 18L, 20L, 22L) Standard Core, Thin Core
Core Thickness (um) Line Width / Space
Bump Pitch
(Mass Volume)		 Layer Counts
4L 6L 8L 10L 12L 14L 16L 18L 20L 22L
Standard Core 1200 9 / 12um
90um		 Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Sample Available
800 Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Sample Available
600 Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production    
400 Mass Production Mass Production Mass Production Mass Production Mass Production Sample Available        
Thin Core 250 9 / 12um
100um		 Mass Production Mass Production Mass Production Mass Production Sample Available          
200   Mass Production Mass Production Mass Production Sample Available          
150   Mass Production Mass Production Sample Available            

* um stands for ㎛

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